Semiconductor Plants in India 2026: Complete List, Locations and Manufacturing Details
India is rapidly emerging as a major semiconductor manufacturing and packaging hub. Under the Semicon India Programme, the Government of India has approved 12 semiconductor manufacturing projects with cumulative investments of more than ₹1.64 lakh crore as of 2026. These projects cover silicon fabrication, compound semiconductors, ATMP/OSAT packaging, testing and advanced semiconductor technologies.
The semiconductor ecosystem is spread across Gujarat, Assam, Uttar Pradesh, Odisha, Punjab and Andhra Pradesh, with Gujarat emerging as the biggest semiconductor cluster.
The projects are expected to strengthen India’s domestic chip supply chain and support industries such as automobiles, smartphones, artificial intelligence, telecommunications, consumer electronics, defence and industrial equipment.
Semiconductors are essential components in modern electronic products, including smartphones, computers, automobiles, medical equipment, telecom systems and AI-enabled devices.
India has traditionally depended heavily on imports for semiconductor components. The government’s semiconductor strategy aims to develop a complete domestic ecosystem covering chip design, fabrication, assembly, testing, packaging, materials and equipment.
The original Semicon India Programme was launched with an outlay of ₹76,000 crore. In July 2026, the Union Cabinet also approved Semicon 2.0 with a budget outlay of ₹1,27,500 crore to further strengthen India’s semiconductor design and manufacturing capabilities.
| Company / Project | Location | Investment | Major Focus |
|---|---|---|---|
| Micron Technology | Sanand, Gujarat | ₹22,516 crore | DRAM & NAND assembly and testing |
| Tata Electronics + PSMC | Dholera, Gujarat | ₹91,526 crore | Silicon semiconductor fabrication |
| Tata Semiconductor Assembly & Test (TSAT) | Morigaon, Assam | ₹27,120 crore | Advanced semiconductor packaging and testing |
| CG Power + Renesas + Stars | Sanand, Gujarat | ₹7,584 crore | Automotive, consumer & industrial chips |
| Kaynes Semicon | Sanand, Gujarat | ₹3,307 crore | Wire-bond and substrate-based packages |
| HCL-Foxconn JV | Jewar, Uttar Pradesh | ₹3,706 crore | Display Driver ICs (DDIC) |
| SiCSem | Bhubaneswar, Odisha | ₹2,066 crore | Silicon Carbide (SiC) semiconductors |
| 3D Glass Solutions | Bhubaneswar, Odisha | ₹1,943 crore | Advanced 3D packaging & glass substrates |
| CDIL | Mohali, Punjab | ₹117 crore | Power semiconductor devices |
| ASIP Technologies | Andhra Pradesh | ₹480 crore | Semiconductor packaging |
| Crystal Matrix | Dholera, Gujarat | Part of ₹3,936 crore for two projects | GaN compound semiconductor & Mini/Micro-LED |
| Suchi Semicon | Surat, Gujarat | Part of ₹3,936 crore for two projects | OSAT for discrete semiconductors |
The first 10 projects were approved under the original India Semiconductor Mission framework. In May 2026, two additional projects—Crystal Matrix Limited and Suchi Semicon—were approved, taking the total number of approved manufacturing projects to 12.
Location: Sanand, Gujarat
Investment: ₹22,516 crore
Technology: ATMP
Products: DRAM and NAND memory products
Micron’s Sanand facility is one of India’s most significant semiconductor projects. The facility focuses on assembly and testing of DRAM and NAND products for domestic and international markets.
According to the government, the facility has a production capacity of approximately 14 million units per week. Micron’s facility began commercial production in 2026, marking an important milestone for India’s semiconductor manufacturing journey.
Location: Dholera, Gujarat
Investment: ₹91,526 crore
Partner: Powerchip Semiconductor Manufacturing Corporation (PSMC), Taiwan
Capacity: 50,000 wafer starts per month
Tata Electronics is developing India’s major silicon semiconductor fabrication facility at Dholera in partnership with Taiwan’s PSMC.
The fab will manufacture semiconductor wafers for applications across automobiles, information technology, telecommunications and other electronics sectors.
The project represents the largest investment among the approved semiconductor projects and is expected to become a cornerstone of India’s domestic chip fabrication ecosystem.
Location: Morigaon, Assam
Investment: ₹27,120 crore
Capacity: 48 million units per day
Tata Semiconductor Assembly and Test Pvt Ltd is establishing a large semiconductor packaging and testing facility in Assam.
The facility will use indigenous semiconductor packaging technologies and is expected to have a production capacity of 48 million units per day.
The project is particularly significant because it is helping establish a high-technology manufacturing ecosystem in Northeast India.
Location: Sanand, Gujarat
Investment: ₹7,584 crore
Partners: Renesas Electronics and Stars Microelectronics
Capacity: Around 15.07 million units per day
CG Power has partnered with Renesas and Stars Microelectronics to establish an advanced semiconductor manufacturing facility.
The facility is designed to manufacture chips for automotive, consumer and industrial applications.
CG Semi’s OSAT facility at Sanand began commercial production in July 2026, making it one of the first facilities in India’s new semiconductor ecosystem to reach commercial production.
Location: Sanand, Gujarat
Investment: ₹3,307 crore
Capacity: More than 6.33 million chips per day
Kaynes Semicon is developing an OSAT facility focused on wire-bond interconnect and substrate-based semiconductor packages.
The facility was inaugurated in March 2026, with commercial production marking another major step in India’s semiconductor manufacturing push.
Location: Jewar, Uttar Pradesh
Investment: ₹3,706 crore
Technology: Display Driver ICs (DDIC)
Capacity: Around 20,000 wafers per month / 36 million chips per month
The HCL-Foxconn joint venture is developing a semiconductor facility in the Jewar region of Uttar Pradesh.
The facility will manufacture Display Driver Integrated Circuits (DDIC) using advanced gold-bump technology. These chips are used in products such as smartphones, televisions, laptops and other display-based electronics.
Location: Bhubaneswar, Odisha
Investment: ₹2,066 crore
Technology: Silicon Carbide (SiC)
SiCSem is establishing a compound semiconductor facility in Odisha focusing on Silicon Carbide semiconductor wafers and packaging.
The project has a proposed wafer production capacity of 5,000 wafers per month, along with packaging capacity of approximately 8 million units per month.
SiC technology is particularly important for applications involving electric vehicles, power electronics, energy systems and industrial equipment.
Location: Bhubaneswar, Odisha
Investment: ₹1,943 crore
Technology: 3D Heterogeneous Integration (3DHI)
3D Glass Solutions is developing an advanced semiconductor packaging facility focused on glass substrate technology and 3D heterogeneous integration.
The technology has applications in areas including AI, aerospace, photonics and advanced computing.
The proposed facility will also work on technologies such as glass interposers, FCBGA assembly and advanced system-in-package solutions.
Location: Mohali, Punjab
Investment: ₹117 crore
Capacity: Around 158.38 million units per year
Continental Device India Limited (CDIL) is expanding its semiconductor manufacturing capabilities in Punjab.
The facility will manufacture high-power discrete semiconductor devices, including MOSFETs, IGBTs, Schottky bypass diodes and transistors, using both silicon and silicon-carbide technologies.
Location: Andhra Pradesh
Investment: ₹480 crore
Capacity: Around 96 million units per year
Advanced System in Package Technologies (ASIP) is establishing a semiconductor packaging facility in Andhra Pradesh in partnership with APACT of South Korea.
The facility will focus on advanced packaging and is expected to produce approximately 96 million units annually.
Location: Dholera, Gujarat
Focus: GaN compound semiconductor and Mini/Micro-LED technology
In May 2026, the Union Cabinet approved Crystal Matrix Limited’s integrated compound semiconductor fabrication and ATMP facility at Dholera.
The project will manufacture Mini/Micro-LED display modules and provide GaN foundry services, including epitaxy on 6-inch wafers.
The proposed annual capacity includes 72,000 square metres of Mini/Micro-LED display panels and 24,000 sets of RGB GaN epitaxy wafers.
Location: Surat, Gujarat
Focus: Discrete semiconductor packaging
Capacity: 1,033.20 million chips per year
Suchi Semicon Private Limited is establishing an OSAT facility in Surat, Gujarat for manufacturing discrete semiconductors.
The facility is designed to produce approximately 1.033 billion chips annually, targeting applications in power electronics, analogue ICs, automotive systems, industrial automation and consumer electronics.
Gujarat has emerged as India’s largest semiconductor manufacturing cluster.
Major projects are located in Sanand, Dholera and Surat, covering silicon fabrication, memory assembly, OSAT, compound semiconductors and advanced display technologies.
Other important semiconductor locations include:
The concentration of multiple projects in Gujarat gives the state a particularly important role in India’s emerging semiconductor ecosystem.
The Semicon India Programme was launched with a total financial outlay of ₹76,000 crore to develop India’s semiconductor and display manufacturing ecosystem.
Its objective is to build capabilities across the semiconductor value chain, including:
By 2026, the government had approved 12 manufacturing projects with cumulative investments of more than ₹1.64 lakh crore.
In July 2026, the Union Cabinet approved Semicon 2.0 with an outlay of ₹1,27,500 crore.
The programme is designed to build on the progress made under Semicon 1.0 and strengthen India’s semiconductor ecosystem through six major pillars:
The government has stated that India’s first major silicon fab is scheduled for commissioning in 2028.
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