India has strengthened the semiconductor manufacturing hub by signing of the $3.3 billion agreement between the Odisha Government, Intel Corporation, and US-based 3D Glass Solutions Inc. This project aims to establish the advanced packaging glass core substrate manufacturing facility in the Bhubaneswar-Khurda region. It is expected to strengthen the India’s semiconductor ecosystem and will support the India Semiconductor Mission.
Odisha, Intel and 3DGS Sign Landmark Semiconductor Agreement
The Government of Odisha, Intel Corporation, and 3D Glass Solutions Inc. (3DGS) has signed the tripartite Memorandum of Understanding (MoU) on May 29, 2026. This agreement focuses on to establishing a state of the art semiconductor packaging and substrate manufacturing facility in the state of Odisha.
The project reflects the India’s growing efforts to build the complete semiconductor value chain and reduce its dependence on imports while attracting global technology leaders to invest in the country. The signing ceremony was attended by the Union Electronics and IT Minister Ashwini Vaishnaw, Odisha Chief Minister Mohan Charan Majhi and Intel CEO Lip-Bu Tan.
$3.3 Billion Investment to Strengthen India’s Chip Ecosystem
This proposed facility involves the estimated investment of $3.3 billion and making it one of the largest semiconductor-related investments in India. This project also aligns with the objectives of the India Semiconductor Mission (ISM). Under this mission it plans to develop the domestic capabilities in semiconductor fabrication, packaging, testing and electronics manufacturing.
The investment showcases the growing international confidence and trust in to the India’s semiconductor policies and manufacturing potential.
What Will the New Facility Manufacture?
The upcoming plant will focus on to the producing advanced semiconductor packaging materials and components.
Products to be Manufactured
- The Advanced Packaging Glass Core Substrates
- High-Density Interconnect (HDI) Substrates
- Advanced Semiconductor Components
- Next-Generation Packaging Solutions
Intel is expected to provide the technical expertise, process support and its advanced manufacturing knowledge to ensure world-class production standards.
Why Glass Core Substrates Are Important
The glass core substrates are emerging as one of the most promising technologies in to the advanced semiconductor packaging. The traditional semiconductor packaging often uses the organic substrates but glass-based substrates offer several advantages.
Benefits of the Glass Core Substrates
- Better thermal performance
- Improved electrical efficiency
- Enhanced signal integrity
- Greater chip density
- Higher energy efficiency
- Better support for AI and high-performance computing applications
These advantages makes the glass substrate technology increasingly important for future semiconductor manufacturing.
How the Project Supports India Semiconductor Mission
The India Semiconductor Mission was launched to build the robust semiconductor manufacturing ecosystem in the country.
The initiative focuses on to the,
- Chip fabrication
- Semiconductor packaging
- Display manufacturing
- Compound semiconductors
- Research and innovation
The state of Odisha project directly contributes to these objectives by the strengthening India’s advanced packaging capabilities and integrating the country more deeply into global semiconductor value chains.
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